CFP: capabilities of cloud computing platforms are being pushed to the edge

Call for Papers
The current activities in Internet of Things (IoT) are focused on architectures & protocols for efficient interconnection of things, infrastructure deployment and creation of value-added services. These activities are largely aided by cloud computing platforms which supports data analysis, management, repository, middleware, APIs etc. But cloud based IoT deployments faces challenges for supporting real time IoT services and providing better consumer experience. Responding to these consumer needs, we have started witnessing a paradigm shift. The capabilities of cloud computing platforms are being pushed to the edge of the networks paving way for Edge Computing (EC). Due to dense geographical distribution, proximity to end-users, support for high mobility and open platform, EC can support applications and services with ultra-low latency and improved QoS. Thus, EC is becoming an important enabler of consumer centric IoT applications and services that demand real-time operations. Standard development organizations like ETSI have also recognized the benefits IoT & EC can bring to the consumers. Potential applications for EC enabled IoT include smart mobility, emergency response, smart cities, video and location based analytics, edge caching and environmental monitoring. This session is proposed and will be organized by IEEE Consumer Electronics Society Future Directions Committee on IoT.
We are soliciting paper for following topics
• Current and future trends in edge computing (EC)
• Resource allocation and management challenges in EC and IoT
• Distributed mobile applications utilizing EC and IoT
• Performance evaluation of IoT and EC test beds
• Consumer centric IoT applications and services using EC platforms
• M2M data processing, management and storage at EC platforms
• Virtualization of EC functionalities
• Security, privacy and trust in IoT and EC
• Standards for IoT and EC
The authors of the accepted papers of this special session will be invited to submit an extended version of their works in an EC special issue of IEEE Consumer Electronics Magazine in 2019.

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